標題: Mass transport phenomena in copper nanowires at high current density
作者: Huang, Yu-Ting
Huang, Chun-Wei
Chen, Jui-Yuan
Ting, Yi-Hsin
Cheng, Shao-Liang
Liao, Chien-Neng
Wu, Wen-Wei
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Cu interconnect;nanowires;electromigration;thermomigration;mass transport;high current density
公開日期: 四月-2016
摘要: Electromigration in Cu has been extensively investigated as the root cause of typical breakdown failure in Cu interconnects. In this study, Cu nanowires connected to Au electrodes are fabricated and observed using in situ transmission electron microscopy to investigate the electro- and thermo-migration processes that are induced by direct current sweeps. We observe the dynamic evolution of different mass transport mechanisms. A current density on the order of 10(6) A/cm(2) and a temperature of approximately 400 A degrees C are sufficient to induce electro- and thermo-migration, respectively. Observations of the migration processes activated by increasing temperatures indicate that the migration direction of Cu atoms is dependent on the net force from the electric field and electron wind. This work is expected to support future design efforts to improve the robustness of Cu interconnects.
URI: http://dx.doi.org/10.1007/s12274-016-0998-9
http://hdl.handle.net/11536/133667
ISSN: 1998-0124
DOI: 10.1007/s12274-016-0998-9
期刊: NANO RESEARCH
Volume: 9
Issue: 4
起始頁: 1071
結束頁: 1078
顯示於類別:期刊論文