完整後設資料紀錄
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dc.contributor.authorBerco, Danen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2017-04-21T06:55:16Z-
dc.date.available2017-04-21T06:55:16Z-
dc.date.issued2016-06en_US
dc.identifier.issn1569-8025en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s10825-015-0744-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/133755-
dc.description.abstractThe authors investigate the conduction filament (CF) properties of a Cu- based conductive bridging resistive memory device by implementing a numerical simulation of the low and high resistive states, starting from a random initial distribution of oxygen vacancies (OV) defects states in the resistive switching layer (RSL) to a formed CF and ending in a ruptured state. A calculation approach which accounts for both the statistical nature of the system and the synergetic effect of OV and Cu species on the overall conductance is presented. By defining a disorder parameter, the correlation between the OV initial distribution and the CF reset behavior is analyzed. A dependence of the reset transition, being either abrupt or progressive, on the physical shape of the CF which in turn is affected by this disorder is shown to exist based on the simulation results.en_US
dc.language.isoen_USen_US
dc.subjectInsulator metal transitionen_US
dc.subjectHafnium oxideen_US
dc.subjectCuen_US
dc.subjectNonvolatile memory (NVM)en_US
dc.subjectConductive bridging resistive switching memory (CBRAM)en_US
dc.titleA numerical analysis of progressive and abrupt reset in conductive bridging RRAMen_US
dc.identifier.doi10.1007/s10825-015-0744-7en_US
dc.identifier.journalJOURNAL OF COMPUTATIONAL ELECTRONICSen_US
dc.citation.volume15en_US
dc.citation.issue2en_US
dc.citation.spage586en_US
dc.citation.epage594en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000375714500026en_US
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