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dc.contributor.authorLiu, Kuan-Juen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLin, Chien-Yuen_US
dc.contributor.authorChen, Ching-Enen_US
dc.contributor.authorTsai, Jyun-Yuen_US
dc.contributor.authorLu, Ying-Hsinen_US
dc.contributor.authorLiu, Hsi-Wenen_US
dc.contributor.authorCheng, Osberten_US
dc.contributor.authorHuang, Cheng-Tungen_US
dc.date.accessioned2017-04-21T06:55:25Z-
dc.date.available2017-04-21T06:55:25Z-
dc.date.issued2016en_US
dc.identifier.issn2162-8769en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0121606jssen_US
dc.identifier.urihttp://hdl.handle.net/11536/133841-
dc.description.abstractThis work demonstrates an abnormal transconductance (GM) enhancement after positive bias stress (PBS) in n-channel high-k/metal gate stacked fin-field-effect-transistors. This abnormal GM enhancement is observed only in short channel devices. With the speculation that hole-trapping-induced electron accumulation is the dominant mechanism, PBS with floating source and drain is adopted as an investigative approach. This, together with the electric field simulation, verifies that hole-trapping in the HfO2 and SiN near the gate corner induces electron accumulated at the ends of the channel length. Such a phenomenon results in a shortening of effective channel length and further GM enhancement. (C) 2016 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleAbnormal Transconductance Enhancement under Positive Bias Stress in Nanoscale n-Channel Fin Field-Effect-Transistorsen_US
dc.identifier.doi10.1149/2.0121606jssen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.citation.volume5en_US
dc.citation.issue6en_US
dc.citation.spageQ155en_US
dc.citation.epageQ159en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000377224700024en_US
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