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dc.contributor.authorChen, Po-Hsunen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorPan, Chih-Hungen_US
dc.contributor.authorLin, Chih-Yangen_US
dc.contributor.authorJin, Fu-Yuanen_US
dc.contributor.authorChen, Min-Chenen_US
dc.contributor.authorHuang, Hui-Chunen_US
dc.contributor.authorLo, Ikaien_US
dc.contributor.authorZheng, Jin-Chengen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2017-04-21T06:55:50Z-
dc.date.available2017-04-21T06:55:50Z-
dc.date.issued2016-03en_US
dc.identifier.issn1882-0778en_US
dc.identifier.urihttp://dx.doi.org/10.7567/APEX.9.034202en_US
dc.identifier.urihttp://hdl.handle.net/11536/134024-
dc.description.abstractIdentical insulators and bottom electrodes were fabricated and capped by an indium tin oxide (ITO) film, either undoped or doped with erbium (Er), as a top electrode. This distinctive top electrode dramatically altered the resistive random access memory (RRAM) characteristics, for example, lowering the operation current and enlarging the memory window. In addition, the RESET voltage increased, whereas the SET voltage remained almost the same. A conduction model of Er-doped ITO is proposed through current-voltage (I-V) measurement and current fitting to explain the resistance switching mechanism of Er-doped ITO RRAM and is confirmed by material analysis and reliability tests. (C) 2016 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleEffects of erbium doping of indium tin oxide electrode in resistive random access memoryen_US
dc.identifier.doi10.7567/APEX.9.034202en_US
dc.identifier.journalAPPLIED PHYSICS EXPRESSen_US
dc.citation.volume9en_US
dc.citation.issue3en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000371302600026en_US
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