標題: | Finite Element Analysis of an Ultrasonic Vibration Device at High Temperatures |
作者: | Lan Phuong Nguyen Tsai, Yen-Pin Hung, Jung-Chung Hsieh, Yi-Chun Hung, Chinghua 機械工程學系 Department of Mechanical Engineering |
關鍵字: | finite element analysis;ultrasonic vibration device;high temperature |
公開日期: | 六月-2016 |
摘要: | Ultrasonic-vibration-assisted forming has been extensively adopted in plastic manufacturing processes. Ultrasonic vibration contributes to enhancing material formability and product quality and to reducing manufacturing costs by improving frictional conditions and increasing the temperature of materials. However, designing a suitable ultrasonic vibration system for processes conducted at high working temperatures, such as the ultrasonic vibration-assisted glass hot embossing process, is difficult because of complex thermal boundaries and material properties. In this study, an ultrasonic vibration system that can be used at high working temperatures was analyzed using the finite element method and ANSYS commercial software. The simulation results obtained from thermal, modal, and harmonic response analyses were compared with experimental measurements to confirm the validity of the numerical analysis. The resulting finite element module can be used in designing the components of ultrasonic vibration devices that can be used at high working temperatures. |
URI: | http://hdl.handle.net/11536/134039 |
ISSN: | 0257-9731 |
期刊: | JOURNAL OF THE CHINESE SOCIETY OF MECHANICAL ENGINEERS |
Volume: | 37 |
Issue: | 3 |
起始頁: | 193 |
結束頁: | 200 |
顯示於類別: | 期刊論文 |