標題: | A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration |
作者: | Hu, Yu-Chen Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Flexible substrate;3D integration;fine-pitch application;bonding |
公開日期: | 1-七月-2016 |
摘要: | A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking. |
URI: | http://dx.doi.org/10.1109/JEDS.2016.2537359 http://hdl.handle.net/11536/134147 |
ISSN: | 2168-6734 |
DOI: | 10.1109/JEDS.2016.2537359 |
期刊: | IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY |
Volume: | 4 |
Issue: | 4 |
起始頁: | 185 |
結束頁: | 188 |
顯示於類別: | 期刊論文 |