標題: A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration
作者: Hu, Yu-Chen
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Flexible substrate;3D integration;fine-pitch application;bonding
公開日期: 1-七月-2016
摘要: A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking.
URI: http://dx.doi.org/10.1109/JEDS.2016.2537359
http://hdl.handle.net/11536/134147
ISSN: 2168-6734
DOI: 10.1109/JEDS.2016.2537359
期刊: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume: 4
Issue: 4
起始頁: 185
結束頁: 188
顯示於類別:期刊論文


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