標題: | Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substate Integration |
作者: | Hu, Yu-Chen Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2016 |
摘要: | An innovative bonding approach applied to flexible substrate bonding is proposed in this research. Thin-film metal pad is fabricated as bonding medium to provide vertical stacking. As compared to other bonding methods, such as anisotropic conductive film (ACF) or non-conductive paste (NCP), thin-film metal pad bonding approach provides the most attractive advantage of fine-pitch. The bonding condition at low temperature exhibits good electrical performance, proving its great potential in the applications of flexible substrate stacking. |
URI: | http://hdl.handle.net/11536/134682 |
ISBN: | 978-1-5090-0726-4 |
期刊: | 2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW) |
起始頁: | 164 |
結束頁: | 165 |
顯示於類別: | 會議論文 |