標題: Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substate Integration
作者: Hu, Yu-Chen
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2016
摘要: An innovative bonding approach applied to flexible substrate bonding is proposed in this research. Thin-film metal pad is fabricated as bonding medium to provide vertical stacking. As compared to other bonding methods, such as anisotropic conductive film (ACF) or non-conductive paste (NCP), thin-film metal pad bonding approach provides the most attractive advantage of fine-pitch. The bonding condition at low temperature exhibits good electrical performance, proving its great potential in the applications of flexible substrate stacking.
URI: http://hdl.handle.net/11536/134682
ISBN: 978-1-5090-0726-4
期刊: 2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW)
起始頁: 164
結束頁: 165
Appears in Collections:Conferences Paper