Title: A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration
Authors: Hu, Yu-Chen
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Keywords: Flexible substrate;3D integration;fine-pitch application;bonding
Issue Date: 1-Jul-2016
Abstract: A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking.
URI: http://dx.doi.org/10.1109/JEDS.2016.2537359
http://hdl.handle.net/11536/134147
ISSN: 2168-6734
DOI: 10.1109/JEDS.2016.2537359
Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume: 4
Issue: 4
Begin Page: 185
End Page: 188
Appears in Collections:期刊論文


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