完整後設資料紀錄
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dc.contributor.authorPhuoc Huu Leen_US
dc.contributor.authorLuo, Chih-Weien_US
dc.contributor.authorJian, Sheng-Ruien_US
dc.contributor.authorLin, Ting-Chunen_US
dc.contributor.authorYang, Ping-Fengen_US
dc.date.accessioned2017-04-21T06:55:12Z-
dc.date.available2017-04-21T06:55:12Z-
dc.date.issued2016-10-01en_US
dc.identifier.issn0254-0584en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.matchemphys.2016.07.006en_US
dc.identifier.urihttp://hdl.handle.net/11536/134215-
dc.description.abstractMechanical properties of thermoelectric (TE) materials are crucial for fabricating efficient and endurable TE devices. In this study, polycrystalline Bi3Se2Te thin films are grown on c-plane sapphire substrates at 250 degrees C and helium gas pressure of 6.5 x 10(-1) Torr using pulsed laser deposition (PLD). The structural, compositional, morphological and mechanical properties of Bi3Se2Te thin films are studied. The Bi3Se2Te thin films are highly c-axis oriented structure and exhibit the stoichiometric compositions of Bi3Se2Te phase. The hardness and Young\'s modulus of the Bi3Se2Te thin films are 5.6 +/- 0.2 GPa and 197.2 +/- 5.4 GPa, respectively, which determined by nanoindentation tests with the continuous stiffness measurement (CSM) mode. The true hardness of the Bi3Se2Te thin films is also calculated using the energy principle of nanoindentation contact. The micro-Vicker indentation-induced fracture behavior of the Bi3Se2Te thin films is observed and discussed. (C) 2016 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectThin filmsen_US
dc.subjectNanoindentationen_US
dc.subjectMechanical propertiesen_US
dc.subjectFractureen_US
dc.titleNanomechanical properties and fracture toughness of Bi3Se2Te thin films grown using pulsed laser depositionen_US
dc.identifier.doi10.1016/j.matchemphys.2016.07.006en_US
dc.identifier.journalMATERIALS CHEMISTRY AND PHYSICSen_US
dc.citation.volume182en_US
dc.citation.spage72en_US
dc.citation.epage76en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000383524900010en_US
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