標題: | Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits |
作者: | Huang, Yu-Chieh Hu, Yu-Chen Huang, Po-Tsang Wu, Shang-Lin You, Yan-Huei Chen, Jr-Ming Huang, Yan-Yu Chang, Hsiao-Chun Lin, Yen-Han Duann, Jeng-Ren Chiu, Tzai-Wen Hwang, Wei Chuang, Ching-Te Chiou, Jin-Chern Chen, Kuan-Neng 交大名義發表 National Chiao Tung University |
關鍵字: | TSV;2.5D;flexible;interposer;neural sensing |
公開日期: | 2016 |
摘要: | Local brain connectivity is expected to lead to new models for neurological diseases, which may in turn result in advanced understanding and better treatment. This paper presents a neural sensing microsystem integrated with TSV-embedded dissolvable mu-needles array, ENIG bonding technology, biocompatible Au-TSV flexible interposer and neural recording circuits, for neural sensing implantation. An ultra-thin film bonding approach is proposed for integration of interposer assembly. Removing bonding wire by proposed bonding technology, the dimension of neural sensing system can be minimized to reduce surgical area and promote implant success rate. The signal quality of neural recording can be significantly improved by eliminating complex signal paths with 2.5D TSV integration from neural sensing interface to neural recording circuits. |
URI: | http://hdl.handle.net/11536/134337 |
ISBN: | 978-1-5090-0638-0 |
期刊: | 2016 IEEE SYMPOSIUM ON VLSI TECHNOLOGY |
顯示於類別: | 會議論文 |