標題: Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits
作者: Huang, Yu-Chieh
Hu, Yu-Chen
Huang, Po-Tsang
Wu, Shang-Lin
You, Yan-Huei
Chen, Jr-Ming
Huang, Yan-Yu
Chang, Hsiao-Chun
Lin, Yen-Han
Duann, Jeng-Ren
Chiu, Tzai-Wen
Hwang, Wei
Chuang, Ching-Te
Chiou, Jin-Chern
Chen, Kuan-Neng
交大名義發表
National Chiao Tung University
關鍵字: TSV;2.5D;flexible;interposer;neural sensing
公開日期: 2016
摘要: Local brain connectivity is expected to lead to new models for neurological diseases, which may in turn result in advanced understanding and better treatment. This paper presents a neural sensing microsystem integrated with TSV-embedded dissolvable mu-needles array, ENIG bonding technology, biocompatible Au-TSV flexible interposer and neural recording circuits, for neural sensing implantation. An ultra-thin film bonding approach is proposed for integration of interposer assembly. Removing bonding wire by proposed bonding technology, the dimension of neural sensing system can be minimized to reduce surgical area and promote implant success rate. The signal quality of neural recording can be significantly improved by eliminating complex signal paths with 2.5D TSV integration from neural sensing interface to neural recording circuits.
URI: http://hdl.handle.net/11536/134337
ISBN: 978-1-5090-0638-0
期刊: 2016 IEEE SYMPOSIUM ON VLSI TECHNOLOGY
Appears in Collections:Conferences Paper