標題: | An Ultra-High-Density 256-channel/25mm(2) Neural Sensing Microsystem using TSV-embedded Neural Probes |
作者: | Huang, Yu-Chieh Huang, Po-Tsang Wu, Shang-Lin Hui, Yu-Chen You, Yan-Huei Chen, Jr-Ming Huang, Yan-Yu Chang, Hsiao-Chun Lin, Yen-Han Duann, Jeng-Ren Chiu, Tzai-Wen Hwang, Wei Chen, Kuan-Neng Chuang, Ching-Te Chiou, Jin-Chern 生物科技學系 電子工程學系及電子研究所 電機工程學系 電控工程研究所 Department of Biological Science and Technology Department of Electronics Engineering and Institute of Electronics Department of Electrical and Computer Engineering Institute of Electrical and Control Engineering |
公開日期: | 2016 |
摘要: | Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm(2) neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable mu-needles, TSV-embedded mu-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable mu-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm x 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8 mu W for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42 mu W and 0.036 mm(2). The overall power of this microsystem is only 3.79mW for 256-channel neural sensing. |
URI: | http://hdl.handle.net/11536/134367 |
ISBN: | 978-1-4799-5341-7 |
ISSN: | 0271-4302 |
期刊: | 2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS) |
起始頁: | 1302 |
結束頁: | 1305 |
顯示於類別: | 會議論文 |