標題: An Ultra-High-Density 256-channel/25mm(2) Neural Sensing Microsystem using TSV-embedded Neural Probes
作者: Huang, Yu-Chieh
Huang, Po-Tsang
Wu, Shang-Lin
Hui, Yu-Chen
You, Yan-Huei
Chen, Jr-Ming
Huang, Yan-Yu
Chang, Hsiao-Chun
Lin, Yen-Han
Duann, Jeng-Ren
Chiu, Tzai-Wen
Hwang, Wei
Chen, Kuan-Neng
Chuang, Ching-Te
Chiou, Jin-Chern
生物科技學系
電子工程學系及電子研究所
電機工程學系
電控工程研究所
Department of Biological Science and Technology
Department of Electronics Engineering and Institute of Electronics
Department of Electrical and Computer Engineering
Institute of Electrical and Control Engineering
公開日期: 2016
摘要: Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm(2) neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable mu-needles, TSV-embedded mu-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable mu-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm x 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8 mu W for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42 mu W and 0.036 mm(2). The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.
URI: http://hdl.handle.net/11536/134367
ISBN: 978-1-4799-5341-7
ISSN: 0271-4302
期刊: 2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS)
起始頁: 1302
結束頁: 1305
顯示於類別:會議論文