Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Chi-Ming | en_US |
dc.contributor.author | Huang, Yong-Jyun | en_US |
dc.contributor.author | Liu, Chih-Wei | en_US |
dc.contributor.author | Hsu, Yarsun | en_US |
dc.date.accessioned | 2017-04-21T06:49:25Z | - |
dc.date.available | 2017-04-21T06:49:25Z | - |
dc.date.issued | 2016 | en_US |
dc.identifier.isbn | 978-1-5090-1570-2 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/134526 | - |
dc.description.abstract | The evolution of wireless communication protocols drives the quest of power-efficient and flexible computing for embedded DSPs, but popular architectures, very-long-instruction word (VLIW) and application-specific instruction set processor (ASIP), serve as opposite extreme cases in regard to power efficiency and flexibility. To this end, we present DeAr: Dual thread Architecture DSP, which manipulates a multi-banked register file that enables simultaneous multi-threading (SMT), and a transport-triggered bus that exploits the data forwarding mechanism in its compact datapath. We also propose a novel scheduling algorithm which leverages the compact hardware to achieve both high throughput and flexible computation. In the experiment of common DSP kernels, DeAr saves 20.3%43.1% and 31.8%-2.2% of power dissipation, 36.1%-31.5% and 28.2%5.7% of area, compared with VLIW and ASIP respectively. | en_US |
dc.language.iso | en_US | en_US |
dc.title | DeAr: A Framework for Power-efficient and Flexible Embedded Digital Signal Processor Design | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2016 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS) | en_US |
dc.citation.spage | 658 | en_US |
dc.citation.epage | 661 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000392651200201 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |