Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hsu, Terng-Ren | en_US |
dc.contributor.author | Hsu, Terng-Yin | en_US |
dc.contributor.author | Yang, Shang-Yi | en_US |
dc.contributor.author | Huang, Wei-Hsin | en_US |
dc.contributor.author | Ou, Zong-Cheng | en_US |
dc.contributor.author | Fan, Ching-Chih | en_US |
dc.date.accessioned | 2017-04-21T06:49:18Z | - |
dc.date.available | 2017-04-21T06:49:18Z | - |
dc.date.issued | 2016 | en_US |
dc.identifier.isbn | 978-1-5090-4769-7 | en_US |
dc.identifier.issn | 2150-5934 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/134595 | - |
dc.description.abstract | In this draft, our purpose is to construct a wearable multi-lead electrocardiogram (ECG) recorder with dry metal electrodes. In general, such as arrhythmia, myocardial ischemia or other heart-related symptoms, using one lead ECG measurements is difficult to accurately diagnose, three-lead ECG should be measured at least. In order to offer sufficient identification information, our scheme is a three-lead ECG solution with recording mode and real-time display mode. Besides, our proposition using dry metal electrodes provide a comfortable sensation, less skin-irritating, easy clean surfaces, reusable capability, and more durability. Due to these advantages, dry metal electrodes are suitable to integrate with underwear. The whole system includes an embedded microcontroller, a memory card interface, analog front-end circuits, user interface devices, power regulators, and so on. All elements integrate within a 5.8cm x 6.8cm four-layer printed circuit board (PCB) to meet the wearable request. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Electrocardiogram (ECG) | en_US |
dc.subject | Dry Metal Electrodes | en_US |
dc.subject | Embedded System | en_US |
dc.subject | micro-SD Card | en_US |
dc.subject | Wearable Devices | en_US |
dc.title | Wearable Multi-lead ECG Recorder with Dry Metal Electrodes | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016) | en_US |
dc.citation.spage | 73 | en_US |
dc.citation.epage | 76 | en_US |
dc.contributor.department | 資訊工程學系 | zh_TW |
dc.contributor.department | Department of Computer Science | en_US |
dc.identifier.wosnumber | WOS:000391819600011 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |