標題: Effect of Sn Grain Orientation on the Formation of Cu6Sn5 Intermetallic Compounds during Electromigration
作者: Shen, Yu-An
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 2016
摘要: Sn grain orientation that has highly anisotropic diffusivities plays a very important role on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.3Ag/Cu microbumps, assembled by thermal-compression bonding, after electromigration test are investigated grain orientation by electron-backscattering diffraction (EBSD). The condition of electromigration test is under the current density of 4x104 A/cm2 and 165 degrees C. In the results, The IMC growth at the interface of Cu/solder is very serious as the electron flow along a low alpha-angle grain as Very serious as that along a high alpha-angle grain. Therefore, we demonstrate IMC formations depend on the angle between c-axis and electron flow in Sn grains.
URI: http://hdl.handle.net/11536/134596
ISBN: 978-1-5090-4769-7
ISSN: 2150-5934
期刊: 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016)
起始頁: 85
結束頁: 86
顯示於類別:會議論文