標題: | Effect of Sn Grain Orientation on the Formation of Cu6Sn5 Intermetallic Compounds during Electromigration |
作者: | Shen, Yu-An Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 2016 |
摘要: | Sn grain orientation that has highly anisotropic diffusivities plays a very important role on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.3Ag/Cu microbumps, assembled by thermal-compression bonding, after electromigration test are investigated grain orientation by electron-backscattering diffraction (EBSD). The condition of electromigration test is under the current density of 4x104 A/cm2 and 165 degrees C. In the results, The IMC growth at the interface of Cu/solder is very serious as the electron flow along a low alpha-angle grain as Very serious as that along a high alpha-angle grain. Therefore, we demonstrate IMC formations depend on the angle between c-axis and electron flow in Sn grains. |
URI: | http://hdl.handle.net/11536/134596 |
ISBN: | 978-1-5090-4769-7 |
ISSN: | 2150-5934 |
期刊: | 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016) |
起始頁: | 85 |
結束頁: | 86 |
顯示於類別: | 會議論文 |