標題: Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016)
作者: Chang, Liang-Hsien
Chen, Chih
Hu, Dyi-Chung
Tain, Ray
Chen, Y. H.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: nt-Cu;(111)-oriented;PCB;electroplating
公開日期: 2016
摘要: Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density and the plating bath are variables. After copper electroplating, XRD, FIB, EBSD were used to observe the microstructure of the films. We found that the as-deposited Cu has > 30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented.
URI: http://hdl.handle.net/11536/134598
ISBN: 978-1-5090-4769-7
ISSN: 2150-5934
期刊: 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016)
起始頁: 198
結束頁: 200
Appears in Collections:Conferences Paper