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dc.contributor.authorSu, Hsin-Wenen_US
dc.contributor.authorChen, Yu-Yuen_US
dc.contributor.authorChen, Chieh-Yangen_US
dc.contributor.authorCheng, Hui-Wenen_US
dc.contributor.authorChang, Han-Tungen_US
dc.contributor.authorLi, Yimingen_US
dc.date.accessioned2017-04-21T06:48:21Z-
dc.date.available2017-04-21T06:48:21Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-4665-6275-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/134777-
dc.description.abstractThis work studies the metal gate\'s work function fluctuation induced DC characteristic fluctuation in the 16-nm bulk and silicon-on-insulator (SOI) fm-type field effect transistor (FinFET) devices using an experimentally calibrated 3D device simulation. The method of localized work function fluctuation simulation enables us to estimate local fluctuations including the nanosized grain\'s random effects of FinFET with TiN/HfO2 gate stacks. The result of this study shows characteristic fluctuation strongly depends upon the size of localized nanosized metal grains. The shape of grains does have marginal influence on device\'s variability.en_US
dc.language.isoen_USen_US
dc.subjectmetal gateen_US
dc.subjectrandom work functionen_US
dc.subjectbulk / SOI FinFETen_US
dc.subjectcharacteristic fluctuationen_US
dc.subject3D device simulationen_US
dc.titleRandom Work Function Induced DC Characteristic Fluctuation in 16-nm High-kappa/Metal Gate Bulk and SOI FinFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalNANOTECHNOLOGY 2012, VOL 2: ELECTRONICS, DEVICES, FABRICATION, MEMS, FLUIDICS AND COMPUTATIONALen_US
dc.citation.spage31en_US
dc.citation.epage34en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000391249200009en_US
dc.citation.woscount0en_US
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