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dc.contributor.authorChou, HYen_US
dc.contributor.authorChen, TMen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:18:45Z-
dc.date.available2014-12-08T15:18:45Z-
dc.date.issued2005-07-21en_US
dc.identifier.issn0022-3727en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0022-3727/38/14/022en_US
dc.identifier.urihttp://hdl.handle.net/11536/13480-
dc.description.abstract110 nm thick SrTiO(3 +/- y)-(SiO2), thin films with x = 0-0.45 were prepared on Pt/Ti/SiO2/Si substrates using the chemical solution deposition method and then annealed at temperatures ranging from 600 degrees C to 900 degrees C for I min. The dielectric and electrical properties of the SrTiO(3 +/- y)-(SiO2)(x) were obviously affected by the annealing temperature and composition. The dielectric constant of the thin films increased with increasing annealing temperature and decreased with an increase in Si content while the leakage current density decreased with an increase in Si content. The 700 degrees C annealed SrTiO(3 +/- y)-(SiO2)(x) thin film with x = 0.25 has a suitable cm(-2). dielectric constant of 94.8 and a low leakage current of 1.27 x 10(-8) A The time-dependent dielectric breakdown curve of the 700 degrees C and 800 degrees C annealed SrTiO(3 +/- y)-(SiO2), films with x = 0.25 have an expected lifetime of over 10 years at electric fields higher than 0.6 MV cm(-1).en_US
dc.language.isoen_USen_US
dc.titleDielectric and electrical properties of SrTiO(3+/-y)-(SiO2)(x) thin filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0022-3727/38/14/022en_US
dc.identifier.journalJOURNAL OF PHYSICS D-APPLIED PHYSICSen_US
dc.citation.volume38en_US
dc.citation.issue14en_US
dc.citation.spage2446en_US
dc.citation.epage2451en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231049400023-
dc.citation.woscount4-
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