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dc.contributor.authorWang, JCen_US
dc.contributor.authorShie, DCen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:18:45Z-
dc.date.available2014-12-08T15:18:45Z-
dc.date.issued2005-07-15en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1977198en_US
dc.identifier.urihttp://hdl.handle.net/11536/13484-
dc.description.abstractA detailed study of soft breakdown modes for hafnium oxynitride (HfON) gate dielectrics under stress is investigated. Two types of soft breakdown, digital and analog modes, are observed in HfON gate dielectrics, featuring gate voltage fluctuation accompanying random telegraph noise and nonswitching 1/f noise, respectively. The dependence of gate area, oxide thickness, and stress current density on breakdown modes is also studied. Thin oxide thickness and small gate area contribute to the enhancement of charge to breakdown (Q(bd)). Large Joule heat damage generated under stress inducing the analog soft breakdown for thick hafnium oxynitride films is proposed to clearly understand the breakdown of HfON gate dielectrics. (c) 2005 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleSoft breakdown of hafnium oxynitride gate dielectricsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.1977198en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume98en_US
dc.citation.issue2en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000230931500104-
dc.citation.woscount4-
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