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dc.contributor.authorLuo, Tseng-Chinen_US
dc.contributor.authorChao, Mango C. -T.en_US
dc.contributor.authorWu, Michael S. -Y.en_US
dc.contributor.authorLi, Kuo-Tsaien_US
dc.contributor.authorHsia, Chin C.en_US
dc.contributor.authorTseng, Huan-Chien_US
dc.contributor.authorHuang, Chuen-Uanen_US
dc.contributor.authorChang, Yuan-Yaoen_US
dc.contributor.authorPan, Samuel C.en_US
dc.contributor.authorYoung, Konrad K. -L.en_US
dc.date.accessioned2017-04-21T06:49:33Z-
dc.date.available2017-04-21T06:49:33Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-4868-5en_US
dc.identifier.issn1089-3539en_US
dc.identifier.urihttp://hdl.handle.net/11536/134994-
dc.description.abstractAs process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (device-under-test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.en_US
dc.language.isoen_USen_US
dc.titleA novel array-based test methodology for local process variation monitoringen_US
dc.typeProceedings Paperen_US
dc.identifier.journalITC: 2009 INTERNATIONAL TEST CONFERENCEen_US
dc.citation.spage511en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000279591000056en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper