Title: Pad Characterization for CMOS Technology Using Time Domain Reflectometry
Authors: Chiu, C. S.
Chen, W. L.
Liao, K. H.
Chen, B. Y.
Teng, Y. M.
Huang, G. W.
Wu, L. K.
電信工程研究所
Institute of Communications Engineering
Keywords: Time domain reflectometry (TDR);Capacitance;Impedance;Pad structure;On-wafer
Issue Date: 2008
Abstract: The pad structure of CMOS technology is characterized by way of time domain reflectometry measurement. Using the on-wafer TDR measurement system, the capacitance of the pad in the CMOS process was extracted and estimated. Measured and Simulated TDR data are also presented in this study. The capacitance is estimated when the curve is fitted by mathematical tool. This method is simple to use, and furthermore the results agree with data extracted from vector network analyzer.
URI: http://hdl.handle.net/11536/135055
ISBN: 978-1-4244-2866-3
Journal: 2008 IEEE INTERNATIONAL RF AND MICROWAVE CONFERENCE, PROCEEDINGS
Begin Page: 214
End Page: +
Appears in Collections:Conferences Paper