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dc.contributor.authorHsu, C. T.en_US
dc.contributor.authorTseng, J. C.en_US
dc.contributor.authorChen, Y. L.en_US
dc.contributor.authorTsai, F. Y.en_US
dc.contributor.authorYu, S. H.en_US
dc.contributor.authorChen, P. A.en_US
dc.contributor.authorKer, M. D.en_US
dc.date.accessioned2017-04-21T06:49:10Z-
dc.date.available2017-04-21T06:49:10Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0918-1en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://dx.doi.org/10.1109/RELPHY.2007.369965en_US
dc.identifier.urihttp://hdl.handle.net/11536/135137-
dc.description.abstractA method utilizing Charged Device Model (CDM) discharging to emulate real-world Charged Board Model (CBM) discharging was proposed and successfully addressed the weakest spot of whole chip. In order to extract the correlation between CDM pre-fail voltage VCDM and CBM pre-fail voltage VcBm, the capacitance and discharging waveforms of output pin on an IC and Printed Circuit Board (PCB) were measured. The results showed that the CBM evaluation board (EB) was not a must for large-size chip, as LCD driver ICs. CDM discharging can be used to direct investigate the weak point of design/layout for large-size chip. Besides, this paper addresses the guidelines about chip-level ESD cell design and layout optimization against CBM ESD damage.en_US
dc.language.isoen_USen_US
dc.subjectESDen_US
dc.subjectCBMen_US
dc.subjectHBMen_US
dc.subjectCDMen_US
dc.subjectPCBen_US
dc.titleBoard level ESD of driver ICS on LCD panelsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/RELPHY.2007.369965en_US
dc.identifier.journal2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUALen_US
dc.citation.spage590en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000246989600106en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper