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dc.contributor.authorLiao, Chan-Yuen_US
dc.contributor.authorHuang, Ching-Yuen_US
dc.contributor.authorHuang, Ming-Huien_US
dc.contributor.authorChou, Chia-Hsinen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.date.accessioned2017-04-21T06:48:55Z-
dc.date.available2017-04-21T06:48:55Z-
dc.date.issued2016-04en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.7567/JJAP.55.04EB07en_US
dc.identifier.urihttp://hdl.handle.net/11536/135167-
dc.description.abstractHigh-quality polycrystalline-germanium (poly-Ge) thin films have been successfully fabricated by excimer laser crystallization (ELC). Grains as large as 1 mu m were achieved by ELC at 300 mJ/cm(2). Meanwhile, the defect-generated hole concentrations in Ge thin films were significantly reduced. Furthermore, the majority carriers could then be converted to n-type by counter doping (CD) with a suitable dose. Then, high-performance p-channel Ge thin-film transistors (TFTs) with a high on/off current ratio of up to 1.7 x 10(3) and a high field-effect mobility of up to 208 cm(2) V-1 s(-1) were demonstrated for a channel width and length both of 0.5 mu m. It was revealed that ELC combined with CD is effective for attaining highp-erformance p-channel poly-Ge TFTs. (C) 2016 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleHigh-performance p-channel polycrystalline-germanium thin-film transistors via excimer laser crystallization and counter dopingen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.7567/JJAP.55.04EB07en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume55en_US
dc.citation.issue4en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000373929400016en_US
dc.citation.woscount0en_US
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