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dc.contributor.authorLu, Chao-Hungen_US
dc.contributor.authorChen, Hung-Mingen_US
dc.contributor.authorLiu, Chien-Nan Jimmyen_US
dc.date.accessioned2017-04-21T06:49:07Z-
dc.date.available2017-04-21T06:49:07Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0629-6en_US
dc.identifier.issn2153-6961en_US
dc.identifier.urihttp://hdl.handle.net/11536/135174-
dc.description.abstractWith technology further scaling into deep submicron era, power supply noise become an important problem. Power supply noise problem is getting worse due to serious IR-drop and simultaneous switching noise, and decoupling capacitance (decap) insertion is commonly applied to alleviate the noise. There exist some approaches to addressing this issue, but they suffer either from over-design problem or late decap insertion during design stage. In this paper, we propose a methodology to insert decap in a more efficient and effective way during early design stage in area-array designs. The experimental results are encouraging. Compared with other approaches in [15] and [12], we have inserted enough decap to meet supply noise constraint while others employ more area.en_US
dc.language.isoen_USen_US
dc.titleOn increasing signal integrity with minimal decap insertion in area-array SoC floorplan designen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF THE ASP-DAC 2007en_US
dc.citation.spage792en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000246176800146en_US
dc.citation.woscount4en_US
Appears in Collections:Conferences Paper