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dc.contributor.authorTsai, W. J.en_US
dc.contributor.authorZous, N. K.en_US
dc.contributor.authorChen, H. Y.en_US
dc.contributor.authorLiu, Lenvisen_US
dc.contributor.authorYeh, C. C.en_US
dc.contributor.authorChen, Samen_US
dc.contributor.authorLu, W. P.en_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.authorKu, Josephen_US
dc.contributor.authorLu, Chih-Yuanen_US
dc.date.accessioned2017-04-21T06:48:16Z-
dc.date.available2017-04-21T06:48:16Z-
dc.date.issued2006en_US
dc.identifier.isbn0-7803-9498-4en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://dx.doi.org/10.1109/RELPHY.2006.251328en_US
dc.identifier.urihttp://hdl.handle.net/11536/135208-
dc.description.abstractIn nitride storage flash memories, the high-V-T state retention loss induced by field and temperature acceleration is compared between single cells and products. Our result reveals that the charge loss path is the same no matter which accelerating methods is used. The traps created at the bottom oxide during P/E cycling provide such leak paths. In addition, the annealing of interface states would play a role in the V-T loss during high-temperature bake.en_US
dc.language.isoen_USen_US
dc.titleInvestigation of charge loss in cycled NBit cells via field and temperature accelerationsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/RELPHY.2006.251328en_US
dc.identifier.journal2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUALen_US
dc.citation.spage693en_US
dc.citation.epage+en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000240855800143en_US
dc.citation.woscount3en_US
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