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dc.contributor.authorChen, S. -H.en_US
dc.contributor.authorLinten, D.en_US
dc.contributor.authorScholz, M.en_US
dc.contributor.authorHellings, G.en_US
dc.contributor.authorBoschke, R.en_US
dc.contributor.authorGroeseneken, G.en_US
dc.contributor.authorHuang, Y. -C.en_US
dc.contributor.authorKer, M. -D.en_US
dc.date.accessioned2017-04-21T06:48:43Z-
dc.date.available2017-04-21T06:48:43Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-3317-4en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://hdl.handle.net/11536/135272-
dc.description.abstractEarly failure has been observed during CDM ESD stress on high-voltage tolerant nLDMOS-SCR devices in a standard low-voltage CMOS technology due to the gate oxide (GOX) degradation. In this work, we propose a special p+/n+ differential doped gate which boosts the CDM ESD failure current level with a factor of 3 to 9.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic Discharge (ESD)en_US
dc.subjectlaterally diffused nMOS (nLDMOS)en_US
dc.subjecthigh-voltage tolerant (HVT) devicesen_US
dc.subjecttransmission line pulsing (TLP) systemen_US
dc.subjectvery fast TLP system (VFTLP)en_US
dc.subjectgate oxide reliabilityen_US
dc.titleImprovement on CDM ESD Robustness of High-Voltage Tolerant nLDMOS SCR Devices by Using Differential Doped Gateen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000343833200068en_US
dc.citation.woscount0en_US
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