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dc.contributor.authorJhu, Jhe-Ciouen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChang, Geng-Weien_US
dc.contributor.authorSyu, Yong-Enen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorJian, Fu-Yenen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorTai, Ya-Hsiangen_US
dc.date.accessioned2017-04-21T06:49:56Z-
dc.date.available2017-04-21T06:49:56Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-60768-317-9en_US
dc.identifier.isbn978-1-56677-959-3en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.3701537en_US
dc.identifier.urihttp://hdl.handle.net/11536/135464-
dc.description.abstractAbnormal sub-threshold leakage current is observed at high temperature in amorphous Indium-Gallium-Zinc-Oxide Thin Film Transistors (a-IGZO TFTs). To confirm this phenomenon\'s dependence on the defects of a-IGZO active layer, this paper examines a device fabricated with N2O plasma treatment at a-IGZO film. This phenomenon only appears in the as-fabricated device, but not in the device with N2O plasma treatment, which is experimentally verified. N2O plasma treatment of a-IGZO TFTs enhance the thin film bonding strength, which could suppress the formation of temperature-dependent point defects. The point defects could be generated from oxygen atoms leaving their original sites above 400K. The N2O plasma treatment devices have better stability performance than as-fabricated devices. The results suggested that the density of point states for a-IGZO TFTs with N2O plasma treatment is much lower than that as-fabricated. The N2O plasma repairs the point defect to suppress temperature-dependent sub-threshold leakage current.en_US
dc.language.isoen_USen_US
dc.titleN2O Plasma Treatment Suppressed Temperature-dependent Point Defects Formation with Amorphous Indium-Gallium-Zinc-Oxide Thin Film Transistorsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/1.3701537en_US
dc.identifier.journalWIDE-BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 13en_US
dc.citation.volume45en_US
dc.citation.issue7en_US
dc.citation.spage169en_US
dc.citation.epage178en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000316687500019en_US
dc.citation.woscount1en_US
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