完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWu, Chien-Hungen_US
dc.contributor.authorChang, Kow-Mingen_US
dc.contributor.authorHuang, Sung-Hungen_US
dc.contributor.authorDeng, I-Chungen_US
dc.contributor.authorWu, Chin-Jyien_US
dc.contributor.authorChiang, Wei-Hanen_US
dc.contributor.authorLin, Je-Weien_US
dc.contributor.authorChang, Chia-Chiangen_US
dc.date.accessioned2017-04-21T06:49:58Z-
dc.date.available2017-04-21T06:49:58Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-60768-317-9en_US
dc.identifier.isbn978-1-56677-959-3en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.3701539en_US
dc.identifier.urihttp://hdl.handle.net/11536/135465-
dc.description.abstractWe fabricated bottom gate TFTs with IGZO channel layer deposited by atmospheric pressure plasma jet (APPJ). The effect of thermal annealing on the properties of IGZO TFTs was studied. After post annealing, the IGZO thin films showed a smooth and dense structure. The transistors annealed at 300 degrees C showed clear switching behavior with a negative threshold voltage of -0.571 V and a mobility of 2.6 cm(2)/V-s. After 500 degrees C post annealing, IGZO thin film showed an amorphous-like phase and the average transmittance is more than 80% in the visible range. Good electrical characteristics were achieved, including a threshold voltage of 6.74V, a subthreshold swing of 1.54 V/dec, a mobility of 10.31 cm(2)/V-s and a large I-on/I-off ratio of 3.28x10(8).en_US
dc.language.isoen_USen_US
dc.titleThe effect of thermal annealing on the properties of IGZO TFT prepared by atmospheric pressure plasma jeten_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/1.3701539en_US
dc.identifier.journalWIDE-BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 13en_US
dc.citation.volume45en_US
dc.citation.issue7en_US
dc.citation.spage189en_US
dc.citation.epage197en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000316687500021en_US
dc.citation.woscount4en_US
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