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dc.contributor.authorTsai, Tsung-Yenen_US
dc.contributor.authorLin, Chien-Hungen_US
dc.contributor.authorLee, Chia-Linen_US
dc.contributor.authorYang, Shan-Chunen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2017-04-21T06:49:49Z-
dc.date.available2017-04-21T06:49:49Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4673-9386-7en_US
dc.identifier.issn2164-0157en_US
dc.identifier.urihttp://hdl.handle.net/11536/135557-
dc.description.abstractAn ultra-fast temporary bonding and release process was investigated for the improvement of 3D integration. The bonding scheme composes of two different kinds of polymer for release layer and adhesive layer. The submicron release layer is a positive photoresist with the characteristic of high UV absorption induced into the de-bonding procedure within 20 s. In addition, the adhesive layer provides robust mechanical strength for the wafer thinning process. Based on results, this structure is a potential candidate for temporary bonding and de-bonding technique in 3D integration.en_US
dc.language.isoen_USen_US
dc.subjectTemporary bonding technologyen_US
dc.subjectlaser release processen_US
dc.subjectphotolysis polymeren_US
dc.subject3D integrationen_US
dc.titleAn Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integrationen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000377084700064en_US
dc.citation.woscount0en_US
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