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dc.contributor.authorWu, Shich-Chuanen_US
dc.contributor.authorYang, Yu-Linen_US
dc.contributor.authorHuang, Wen-Hsienen_US
dc.contributor.authorHuang, Yang-Tungen_US
dc.date.accessioned2017-04-21T06:48:38Z-
dc.date.available2017-04-21T06:48:38Z-
dc.date.issued2010en_US
dc.identifier.isbn978-1-56677-833-6en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.3491768en_US
dc.identifier.urihttp://hdl.handle.net/11536/135591-
dc.description.abstractWe selected copper as the material to form the 3D structures with feature sizes of 0.4 mu m to study its desirable optical properties at near infrared wavelengths from using the high compatible process of damascene copper interconnections technique. The reflectance and transmittance spectra of the 3D copper photonic crystals were measured with the Fourier-transform infrared (FTIR) spectroscopy and simulated with the 3D FDTD method. Through both the experimental observation and the calculation verification, the characterization of the PBG is right at near infrared wavelengths. It is worth noted that some interesting behavior were observed in the spectra and transmitting ratio under different polarization incident conditions.en_US
dc.language.isoen_USen_US
dc.titleLayer-by-Layer Copper Photonic Crystals for Near Infrared Spectral Regionen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/1.3491768en_US
dc.identifier.journalNANOTECHNOLOGY (GENERAL) - 217TH ECS MEETINGen_US
dc.citation.volume28en_US
dc.citation.issue7en_US
dc.citation.spage9en_US
dc.citation.epage16en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000314958100002en_US
dc.citation.woscount0en_US
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