Fabrication of Three Dimensional Cu Metallic Photonic Crystal by Electroless Plating

Abstract

A 3D copper (Cu) metallic photonic crystal (MPC) with 180nm line width was fabricated by electroless plating. The mold of 3D MPC for Cu replacement is poly-Si. It has been verified as an enhancing thermal photovoltaic effect while the mold was transferred into tungsten MPC by chemical vapor deposition method. The 5 layers structure of Cu MPC was clear observed with scanning electron microscopy. The photonic band-gap ranged from 1.5 to 13 m was measured by Fourier transform infrared spectroscopy (FTIR) instrument.