Fabrication of Three Dimensional Cu Metallic Photonic Crystal by Electroless Plating

標題:	Fabrication of Three Dimensional Cu Metallic Photonic Crystal by Electroless Plating
作者:	Wu, S-C Hou, F-J Jang-Jian, P-C Tsai, M-S Chen, M-C Li, L-S Huang, J-Y Lin, S-Y 材料科學與工程學系光電工程學系 Department of Materials Science and Engineering Department of Photonics
關鍵字:	Copper metal photonic crystal;electroless plating;photonic band-gap
公開日期:	1-Jan-2007
摘要:	A 3D copper (Cu) metallic photonic crystal (MPC) with 180nm line width was fabricated by electroless plating. The mold of 3D MPC for Cu replacement is poly-Si. It has been verified as an enhancing thermal photovoltaic effect while the mold was transferred into tungsten MPC by chemical vapor deposition method. The 5 layers structure of Cu MPC was clear observed with scanning electron microscopy. The photonic band-gap ranged from 1.5 to 13 m was measured by Fourier transform infrared spectroscopy (FTIR) instrument.
URI:	http://dx.doi.org/10.1088/1742-6596/61/1/249 http://hdl.handle.net/11536/135177
ISSN:	1742-6588
DOI:	10.1088/1742-6596/61/1/249
期刊:	PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON NANOSCIENCE AND TECHNOLOGY
Volume:	61
起始頁:	1261
結束頁:	1265
Appears in Collections:	Conferences Paper

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