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dc.contributor.authorWang, YYen_US
dc.contributor.authorHsieh, TEen_US
dc.date.accessioned2014-12-08T15:18:51Z-
dc.date.available2014-12-08T15:18:51Z-
dc.date.issued2005-06-28en_US
dc.identifier.issn0897-4756en_US
dc.identifier.urihttp://dx.doi.org/10.1021/cm0487268en_US
dc.identifier.urihttp://hdl.handle.net/11536/13569-
dc.description.abstractA functionalized surfactant, GME-N-C-10 containing a C=C double bond, was synthesized to modify clays such as montmorillonite (MMT) and mica for the preparation of organic-inorganic composite resins via radical photoinduced polymerization. As revealed by X-ray diffraction (XRD) analysis of the organophilic samples, the synthesized surfactant was successfully intercalated into the layers of clay by its full molecular length and such an intercalation generated a paraffin-like structure in the modified clays. By forming the C-C bonds between surfactants and oligomers/monomers during subsequent radical photoinduced polymerization, the hybrid comprising organophilic clay/oligomers/monomers became an intercalated nanocomposite resin. The thickness of the dispersed lamellae was less than 100 nm, as revealed by transmission electron microscopy (TEM). For the composite sample containing 5.0 wt.% of organophilic clay, the decomposition temperatures raised at least 15 degrees C; the transmittance detected by UV-visible spectrometer showed a less than 15% loss in the visible light region but a satisfactory transparency was still retained, and the degree of moisture absorption decreased from 3.4% to about 1% due to dispersive organophilic clay in the polymer matrix.en_US
dc.language.isoen_USen_US
dc.titlePreparation and properties of polyacrylate/clay photocured nanocomposite materialsen_US
dc.typeArticleen_US
dc.identifier.doi10.1021/cm0487268en_US
dc.identifier.journalCHEMISTRY OF MATERIALSen_US
dc.citation.volume17en_US
dc.citation.issue13en_US
dc.citation.spage3331en_US
dc.citation.epage3337en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000230075800005-
dc.citation.woscount18-
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