標題: A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration
作者: Li, Chun-Hsing
Lai, Chih-Wei
Yan, Tzu-Chao
Kuo, Chien-Nan
電機工程學系
Department of Electrical and Computer Engineering
關鍵字: Bondwire;broadband;interconnect;THz;heterogeneous integration
公開日期: 2015
摘要: A low-cost broadband bondwire interconnect is proposed for THz heterogeneous system integration. A transversal path composed of two transmission lines and a bondwire is introduced to effectively reduce the bondwire effect of an original signal path consisted of a single bondwire only. Simulation results indicate that the return loss and insertion loss can be better than 15 dB and 2.3 dB from dc to 456 GHz, respectively. Measured interconnect loss is around 0 dB to 1.5 dB from 320 to 340 GHz.
URI: http://hdl.handle.net/11536/135829
ISBN: 978-1-4799-8275-2
ISSN: 0149-645X
期刊: 2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS)
Appears in Collections:Conferences Paper