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dc.contributor.authorHsieh, E. R.en_US
dc.contributor.authorLin, Y. S.en_US
dc.contributor.authorZhao, Y. B.en_US
dc.contributor.authorLiu, C. H.en_US
dc.contributor.authorChien, C. H.en_US
dc.contributor.authorChung, Steve S.en_US
dc.date.accessioned2017-04-21T06:49:45Z-
dc.date.available2017-04-21T06:49:45Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4673-7604-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/135837-
dc.description.abstractA new concept of the structure design with an alignment between the maximum band-to-band tunneling rate and electric field has been proposed to enhance the performance of TFETs. It was found that the specific gate of TFET to form an obtuse shape can dramatically improve the on-current of TFET, with over 4 order improvement in comparison to planar ones. This complementary TFET (CTFET) was also demonstrated by SRAM as a benchmark, with SiGe/Si integrated with III-V on Si substrate. In order to increase WNM and RSNM of CTFET SRAM, a new scheme has been adopted, in which SRAM has been successfully demonstrated with operating bias down to 0.3V.en_US
dc.language.isoen_USen_US
dc.titleDesign of Complementary Tilt-gate TFETs with SiGe/Si and III-V Integrations Feasible for Ultra-low-power Applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2015 SILICON NANOELECTRONICS WORKSHOP (SNW)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380461900047en_US
dc.citation.woscount0en_US
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