完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yang, Chih-Chao | en_US |
dc.contributor.author | Hsieh, Tung-Ying | en_US |
dc.contributor.author | Huang, Wen-Hsien | en_US |
dc.contributor.author | Wu, Tsung-Ta | en_US |
dc.contributor.author | Wang, Hsing-Hsiang | en_US |
dc.contributor.author | Shen, Chang-Hong | en_US |
dc.contributor.author | Kao, Ming-Hsuan | en_US |
dc.contributor.author | Yeh, Wen-Kuan | en_US |
dc.contributor.author | Chang, Meng-Fan | en_US |
dc.contributor.author | Wu, Meng-Chyi | en_US |
dc.contributor.author | Shieh, Jia-Min | en_US |
dc.date.accessioned | 2017-04-21T06:49:12Z | - |
dc.date.available | 2017-04-21T06:49:12Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.isbn | 978-1-5090-0259-7 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/135851 | - |
dc.description.abstract | High performance 3D sequentially stackable nanowire FETs and non-volatile memories (NVMs) with threshold voltage engineering and driving current boosting technologies were demonstrated by using low thermal budget nanosecond laser crystallization and laser activation technologies. The local heating laser process without damaging the underlying device/circuit realizes the across -layer and in -layer integration of high-speed 3ps logic circuits and 1-T 100ns plasma-MONOS NVMs as well as low driving-voltage 6T SRAMs with static noise margin (SNM) of 280 mV. Such logic/memory hybrid 3D sequentially integrated circuit provides power efficient computing and storage. Moreover, the monolithically stacking of Si thin-film energy harvester envisions lower power and low cost 3D(+)IC for internet of things. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | 3DIC | en_US |
dc.subject | monolithic 3D | en_US |
dc.subject | low thermal budget | en_US |
dc.subject | laser anneal | en_US |
dc.title | Logic/Memory Hybrid 3D Sequentially Integrated Circuit Using Low Thermal Budget Laser Process | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2015 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | en_US |
dc.contributor.department | 光電工程學系 | zh_TW |
dc.contributor.department | Department of Photonics | en_US |
dc.identifier.wosnumber | WOS:000370657300029 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 會議論文 |