完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYang, Shang-Hsienen_US
dc.contributor.authorWey, Chin-Longen_US
dc.contributor.authorChen, Ke-Horngen_US
dc.contributor.authorLin, Ying-Hsien_US
dc.contributor.authorChen, Jing-Jiaen_US
dc.contributor.authorTsai, Tsung-Yenen_US
dc.contributor.authorLee, Chao-Chengen_US
dc.date.accessioned2017-04-21T06:49:41Z-
dc.date.available2017-04-21T06:49:41Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-4089-9en_US
dc.identifier.urihttp://hdl.handle.net/11536/135864-
dc.description.abstracta buck/boost supply modulator (BBSM) is proposed for 4G LTE RF power amplifier (RF-PA) envelope tracking applications. The H-bridges used in non-inverting buck/boost converters are metamorphosed into the current sources and switches of a 4-bit current-steering DAC-like supply modulator. Fast tracking speed is achieved through its inherent open-loop topology, while the direct digital interface provides easy control and integration with digital LTE baseband SoCs. The proposed BBSM is capable of delivering peak power of 2.8W at 20MS/s, with a peak efficiency of 75 %.en_US
dc.language.isoen_USen_US
dc.subjectSupply modulatoren_US
dc.subjectenvelope trackingen_US
dc.subjectnon-inverting buck/boost converteren_US
dc.titleA 20MS/s Buck/Boost Supply Modulator for Envelope Tracking Applications with Direct Digital Interfaceen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC)en_US
dc.citation.spage73en_US
dc.citation.epage76en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000380484900019en_US
dc.citation.woscount0en_US
顯示於類別:會議論文