標題: Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology
作者: Tsai, Tsung-Yen
Chang, Yao-Jen
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2015
摘要: A submicron of Ni/Sn transient liquid phase bonding at low temperature was investigated to surmount nowadays fine-pitch Cu/Sn process challenge. After bonding process, only uniform and high-temperature stable Ni3Sn4 intermetallic compound was existed. In addition, the advantages of this scheme showed excellent electrical and reliability performance and mechanical strength.
URI: http://hdl.handle.net/11536/136094
ISBN: 978-1-4799-9928-6
ISSN: 1946-1550
期刊: PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)
起始頁: 35
結束頁: 38
Appears in Collections:Conferences Paper