Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Tsai, Tsung-Yen	en_US
dc.contributor.author	Chang, Yao-Jen	en_US
dc.contributor.author	Chen, Kuan-Neng	en_US
dc.date.accessioned	2017-04-21T06:48:45Z	-
dc.date.available	2017-04-21T06:48:45Z	-
dc.date.issued	2015	en_US
dc.identifier.isbn	978-1-4799-9928-6	en_US
dc.identifier.issn	1946-1550	en_US
dc.identifier.uri	http://hdl.handle.net/11536/136094	-
dc.description.abstract	A submicron of Ni/Sn transient liquid phase bonding at low temperature was investigated to surmount nowadays fine-pitch Cu/Sn process challenge. After bonding process, only uniform and high-temperature stable Ni3Sn4 intermetallic compound was existed. In addition, the advantages of this scheme showed excellent electrical and reliability performance and mechanical strength.	en_US
dc.language.iso	en_US	en_US
dc.title	Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)	en_US
dc.citation.spage	35	en_US
dc.citation.epage	38	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000380466200011	en_US
dc.citation.woscount	0	en_US
顯示於類別：	會議論文