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dc.contributor.authorGuo, Zi-Lien_US
dc.contributor.authorFu, Yu-Minen_US
dc.contributor.authorCheng, Yu-Tingen_US
dc.contributor.authorShew, Bor-Yuanen_US
dc.contributor.authorWu, Pu-Weien_US
dc.date.accessioned2017-04-21T06:49:47Z-
dc.date.available2017-04-21T06:49:47Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4799-9928-6en_US
dc.identifier.issn1946-1550en_US
dc.identifier.urihttp://hdl.handle.net/11536/136097-
dc.description.abstractIn the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical conductivity of the printed Ag interconnects at low process temperature. A 10 mu m wide Ag interconnect with flat surface morphology and low electrical resistivity, i.e. 7.7 mu Omega center dot cm, has been realized.en_US
dc.language.isoen_USen_US
dc.titleCharacteristic Improvement of Inkjet Printed Ag Interconnects Using Tape On-Off and Mirror-Reaction Processesen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)en_US
dc.citation.spage41en_US
dc.citation.epage44en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380466200013en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper