Title: An Au-free GaN High Electron Mobility Transistor with Ti/Al/W Ohmic Metal Structure
Authors: Yao, Jing-Neng
Lin, Yueh-Chin
Chuang, Yu-Lin
Huang, Yu-Xiang
Shih, Wang-Cheng
Sze, Simon M.
Chang, Edward Yi
材料科學與工程學系
光電系統研究所
電子工程學系及電子研究所
Department of Materials Science and Engineering
Institute of Photonic System
Department of Electronics Engineering and Institute of Electronics
Issue Date: 2015
Abstract: We demonstrate the Au-free GaN HEMT device with the Ti/Al/W Ohmic metal structure. Excellent surface roughness 4.88nm for Ti/Al/W Ohmic stucture was achieved after metallization. The DC characteristics is comparable with conventional HEMTs and the stress performance with high voltage is better than conventional HEMTs.
URI: http://hdl.handle.net/11536/136108
ISBN: 978-1-4799-9928-6
ISSN: 1946-1550
Journal: PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)
Begin Page: 394
End Page: 397
Appears in Collections:Conferences Paper