Title: | An Au-free GaN High Electron Mobility Transistor with Ti/Al/W Ohmic Metal Structure |
Authors: | Yao, Jing-Neng Lin, Yueh-Chin Chuang, Yu-Lin Huang, Yu-Xiang Shih, Wang-Cheng Sze, Simon M. Chang, Edward Yi 材料科學與工程學系 光電系統研究所 電子工程學系及電子研究所 Department of Materials Science and Engineering Institute of Photonic System Department of Electronics Engineering and Institute of Electronics |
Issue Date: | 2015 |
Abstract: | We demonstrate the Au-free GaN HEMT device with the Ti/Al/W Ohmic metal structure. Excellent surface roughness 4.88nm for Ti/Al/W Ohmic stucture was achieved after metallization. The DC characteristics is comparable with conventional HEMTs and the stress performance with high voltage is better than conventional HEMTs. |
URI: | http://hdl.handle.net/11536/136108 |
ISBN: | 978-1-4799-9928-6 |
ISSN: | 1946-1550 |
Journal: | PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015) |
Begin Page: | 394 |
End Page: | 397 |
Appears in Collections: | Conferences Paper |