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dc.contributor.authorLin, Ta-Kaien_US
dc.contributor.authorLin, Kuen-Weyen_US
dc.contributor.authorChiu, Chang-Haoen_US
dc.contributor.authorLin, Rung-Binen_US
dc.date.accessioned2017-04-21T06:50:00Z-
dc.date.available2017-04-21T06:50:00Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4503-2816-6en_US
dc.identifier.issn1066-1395en_US
dc.identifier.urihttp://dx.doi.org/10.1145/2591513.2591601en_US
dc.identifier.urihttp://hdl.handle.net/11536/136154-
dc.description.abstractThis paper presents a via-configurable logic block and a design methodology for realizing fine-grained dual-supply-voltage structured ASIC. Experiments with a 90nm process technology show that, given various timing budgets, our approach can achieve up to 44% energy reduction with 1.6% area overhead on level converters. Compared with GECVS, our approach converts up to 39% more high-supply voltage gates into low-supply voltage gates.en_US
dc.language.isoen_USen_US
dc.subjectStructured ASICen_US
dc.subjectVia configurableen_US
dc.subjectDual supply voltageen_US
dc.subjectLow poweren_US
dc.subjectStandard cellen_US
dc.subjectLevel converteren_US
dc.titleLogic Block and Design Methodology for Via-Configurable Structured ASIC Using Dual Supply Voltagesen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1145/2591513.2591601en_US
dc.identifier.journalGLSVLSI'14: PROCEEDINGS OF THE 2014 GREAT LAKES SYMPOSIUM ON VLSIen_US
dc.citation.spage111en_US
dc.citation.epage116en_US
dc.contributor.department資訊工程學系zh_TW
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.identifier.wosnumberWOS:000380617300030en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper