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dc.contributor.authorChung, Steve S.en_US
dc.date.accessioned2017-04-21T06:49:28Z-
dc.date.available2017-04-21T06:49:28Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-3282-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/136232-
dc.description.abstractThe random dopant fluctuation is one of the most important issues for ultra-scaled CMOS devices in terms of the device architecture and manufacturing. This paper will present a unified method on the understanding of the variations caused by the random dopant and the gate oxide thickness of the trigate FinFET with a peculiar 3D gate structure. The dopant fluctuation is known to be reduced in a trigate comparing to a planar transistor, while it depends on the fin-height. Another source of variation is the gate leakage variation caused by the surface roughness effect. Both types of variation posed severe challenges for putting the trigate into the manufacturing. The method to understand these effects and the experimental procedures will be demonstrated. A measure of the variation by the Pelgrom plot will be specifically addressed.en_US
dc.language.isoen_USen_US
dc.titleThe Impact of the Three-Dimensional Gate on the Trigate FinFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380478500233en_US
dc.citation.woscount0en_US
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