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dc.contributor.authorChung, Steve S.en_US
dc.date.accessioned2017-04-21T06:49:07Z-
dc.date.available2017-04-21T06:49:07Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-4673-8258-8en_US
dc.identifier.issn1946-1550en_US
dc.identifier.urihttp://hdl.handle.net/11536/136409-
dc.description.abstractThe experimental RTN-trap profiling method bas been demonstrated on both planar and trigate MOSFETs. It was achieved by a simple experimental method to take the 2D profiling of the RTN-trap in both oxide depth (vertical) and channel (lateral) directions in the gate oxide. Then, by arranging various 2D fields for the device stress condition, the positions of RTN traps can be precisely controlled. The positions of RTN-traps can be manipulated, showing significant advances for the understanding of the trap generation and the impact on the device reliability. Results have demonstrated why trigate exhibits much worse reliability than the planar ones.en_US
dc.language.isoen_USen_US
dc.titleRecent Advances of RTN Technique Towards the Understanding of the Gate Dielectric Reliability in Trigate FinFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalProceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)en_US
dc.citation.spage33en_US
dc.citation.epage37en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000389243200008en_US
dc.citation.woscount0en_US
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