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dc.contributor.authorChen, Chihen_US
dc.contributor.authorLiu, Chien-Minen_US
dc.contributor.authorLu, Tien-Linen_US
dc.contributor.authorLin, Han-wenen_US
dc.contributor.authorChu, Yi-Chengen_US
dc.contributor.authorLu, Chia-Lingen_US
dc.contributor.authorJuang, Jing-Yeen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.contributor.authorTu, K. N.en_US
dc.date.accessioned2017-04-21T06:48:21Z-
dc.date.available2017-04-21T06:48:21Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-5090-0386-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/136457-
dc.language.isoen_USen_US
dc.titleFabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devicesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC)en_US
dc.citation.spage27en_US
dc.citation.epage27en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000387046400010en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper


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