| 標題: | Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices |
| 作者: | Chen, Chih Liu, Chien-Min Lu, Tien-Lin Lin, Han-wen Chu, Yi-Cheng Lu, Chia-Ling Juang, Jing-Ye Chen, Kuan-Neng Tu, K. N. 材料科學與工程學系 電子工程學系及電子研究所 Department of Materials Science and Engineering Department of Electronics Engineering and Institute of Electronics |
| 公開日期: | 2016 |
| URI: | http://hdl.handle.net/11536/136457 |
| ISBN: | 978-1-5090-0386-0 |
| 期刊: | 2016 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC) |
| 起始頁: | 27 |
| 結束頁: | 27 |
| Appears in Collections: | Conferences Paper |
- <111>奈米雙晶銅墊層之銲錫接點的電遷移及界面冶金反應研究 / 陳智;Chen Chih
- Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition / Lu, Tien-Lin;Shen, Yu-An;Wu, John A.;Chen, Chih
- Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition / Liu, Tao-Chi;Liu, Chien-Min;Hsiao, Hsiang-Yao;Lu, Jia-Ling;Huang, Yi-Sa
- Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu / Juang, Jing-Ye;Lu, Chia-Ling;Li, Yu-Jin;Tu, K. N.;Chen, Chih
- Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu / Liu, Chien-Min;Lin, Han-Wen;Lu, Chia-Ling;Chen, Chih
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