Full metadata record
DC FieldValueLanguage
dc.contributor.authorPey, KLen_US
dc.contributor.authorTrigg, Aen_US
dc.contributor.authorChung, Sen_US
dc.date.accessioned2014-12-08T15:19:03Z-
dc.date.available2014-12-08T15:19:03Z-
dc.date.issued2005-06-01en_US
dc.identifier.issn1530-4388en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TDMR.2005.849903en_US
dc.identifier.urihttp://hdl.handle.net/11536/13677-
dc.language.isoen_USen_US
dc.titleIntroduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)en_US
dc.typeEditorial Materialen_US
dc.identifier.doi10.1109/TDMR.2005.849903en_US
dc.identifier.journalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITYen_US
dc.citation.volume5en_US
dc.citation.issue2en_US
dc.citation.spage167en_US
dc.citation.epage167en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000230223000001-
dc.citation.woscount1-
Appears in Collections:Articles


Files in This Item:

  1. 000230223000001.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.