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dc.contributor.authorLai, CSen_US
dc.contributor.authorWu, WCen_US
dc.contributor.authorWang, JCen_US
dc.contributor.authorChao, Ten_US
dc.date.accessioned2014-12-08T15:19:05Z-
dc.date.available2014-12-08T15:19:05Z-
dc.date.issued2005-05-30en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1944230en_US
dc.identifier.urihttp://hdl.handle.net/11536/13694-
dc.description.abstractIn this paper, fluorine incorporation into the HfO2 gate dielectrics by post CF4 plasma treatment was proposed to improve the electrical characterization. TaN-HfO2-p-Si capacitors were demonstrated in this work. The characteristics of fluorinated HfO2 gate dielectrics were improved, including the capacitance-voltage hysteresis and current-voltage behaviors. This may be attributed to the fluorine incorporated into the HfO2 gate dielectrics as revealed by secondary ion mass spectroscopy. Moreover, the formation of Hf-F bonding was observed through electron spectroscopy for chemical analysis spectra. (c) 2005 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleCharacterization of CF4-plasma fluorinated HfO2 gate dielectrics with TaN metal gateen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.1944230en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume86en_US
dc.citation.issue22en_US
dc.citation.epageen_US
dc.contributor.department物理研究所zh_TW
dc.contributor.departmentInstitute of Physicsen_US
dc.identifier.wosnumberWOS:000229590100057-
dc.citation.woscount30-
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