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dc.contributor.authorHuang, HWen_US
dc.contributor.authorKao, CCen_US
dc.contributor.authorChu, JIen_US
dc.contributor.authorKuo, HCen_US
dc.contributor.authorWang, SCen_US
dc.contributor.authorYu, CCen_US
dc.date.accessioned2014-12-08T15:19:14Z-
dc.date.available2014-12-08T15:19:14Z-
dc.date.issued2005-05-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2005.846741en_US
dc.identifier.urihttp://hdl.handle.net/11536/13771-
dc.description.abstractThis investigation describes the development of InGaN-GaN light-emitting diode (LED) with a nano-roughened top p-GaN surface which uses Ni nano-mask and wet etching. The light output of the InGaN-GaN LED with a nano-roughened top p-GaN surface is 1.4 times that of a conventional LED, and wall-plug efficiency is 45% higher. The operating voltage of InGaN-GaN LED was reduced from 3.65 to 3.5 V at 20 mA and the series resistance was reduced by 20%. The light output is increased by the nano-roughening of the top p-GaN surface. The reduction in the series resistance can be attributed to the increase in the contact area of nano-roughened surface.en_US
dc.language.isoen_USen_US
dc.subjectgallium nitride (GaN)en_US
dc.subjectlight-emitting diode (LED)en_US
dc.subjectnano-masken_US
dc.subjectnickelen_US
dc.titleImprovement of InGaN-GaN light-emitting diode performance with a nano-roughened p-GaN surfaceen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2005.846741en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume17en_US
dc.citation.issue5en_US
dc.citation.spage983en_US
dc.citation.epage985en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000228567300017-
dc.citation.woscount67-
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